SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
To polish a substrate while suppressing occurrence of damage of the substrate over a whole in a radial direction of the substrate.SOLUTION: A substrate treatment apparatus includes: a holding section which holds a substrate; a rotation section which rotates the holding section and rotates the substr...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To polish a substrate while suppressing occurrence of damage of the substrate over a whole in a radial direction of the substrate.SOLUTION: A substrate treatment apparatus includes: a holding section which holds a substrate; a rotation section which rotates the holding section and rotates the substrate together with the holding section; a liquid supply section which supplies washing liquid to a main surface of the substrate; a polishing head which polishes the main surface of the substrate; a moving section which presses the polishing head on the main surface of the substrate and scans the polishing head in a radial direction of the substrate; and a control section which controls the rotation section, the liquid supply section, and the moving section. The control section sets a dividing line for dividing the main surface of the substrate into a plurality of regions in the radial direction of the substrate and executes the supply of the washing liquid and scanning of the polishing head in a subsequent state in which the supply of the washing liquid is stopped for each region.SELECTED DRAWING: Figure 5
【課題】基板の径方向全体に亘って、基板の傷の発生を抑制しつつ、基板を研磨できる。【解決手段】基板を保持する保持部と、前記保持部を回転させ、前記保持部と共に前記基板を回転させる回転部と、前記基板の主面に洗浄液を供給する液供給部と、前記基板の前記主面を研磨する研磨ヘッドと、前記研磨ヘッドを、前記基板の前記主面に押し当て、前記基板の径方向にスキャンする移動部と、前記回転部と、前記液供給部と、前記移動部とを制御する制御部とを備え、前記制御部は、前記基板の前記主面を前記基板の径方向に複数の領域に分割する分割線を設定し、前記領域毎に、前記洗浄液の供給と、続く前記洗浄液の供給を停止した状態での前記研磨ヘッドのスキャンとを実施する、基板処理装置。【選択図】図5 |
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