MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

To provide a multilayer ceramic electronic component in which uneven distribution of hydrogen in a ceramic element assembly is hardly to occur.SOLUTION: A multilayer ceramic electronic component includes a ceramic element assembly and an external electrode. The ceramic element assembly includes: a plurality of internal electrodes stacked in a uniaxial direction; and an end face which extends along a plane parallel to a uniaxis and from which at least part of the plurality of internal electrodes is pulled out. The external electrode covers the end face of the ceramic element assembly. The plurality of internal electrodes each consist primarily of Cu, and include an additive element consisting of at least one of Al, Si, P, S, Cl, Zn, Ga, Ge, Se, Br, Nb, Ag, In, Sn, Sb, Te, I, Hf, Ta, W, Pt, Au, Pb and Bi, or consist primarily of Ni, and include an additive element consisting of at least one of Al, Si, P,V, Cr, Mn, Zn, Ga, Ge, Se, Br, Zr, Nb, Mo, Ru, Pd, Ag, In, Sn, Sb, Te, I, Hf, Ta, W, Pt, Au, Pb and Bi.SELECTED DRAWING: Figure 2 【課題】セラミック素体内における水素の偏在が生じにくい積層セラミック電子部品を提供する。【解決手段】積層セラミック電子部品は、セラミック素体と、外部電極と、を具備する。セラミック素体は、一軸方向に積層された複数の内部電極と、一軸と平行な平面に沿って延び、複数の内部電極のうちの少なくとも一部が引き出された端面と、を有する。外部電極は、セラミック素体の端面を覆う。複数の内部電極は、Ｃｕを主成分とし、Ａｌ，Ｓｉ，Ｐ，Ｓ，Ｃｌ，Ｚｎ，Ｇａ，Ｇｅ，Ｓｅ，Ｂｒ，Ｎｂ，Ａｇ，Ｉｎ，Ｓｎ，Ｓｂ，Ｔｅ，Ｉ，Ｈｆ，Ｔａ，Ｗ，Ｐｔ，Ａｕ，Ｐｂ，Ｂｉの少なくとも１つで構成される添加元素を含む、或いは、Ｎｉを主成分とし、Ａｌ，Ｓｉ，Ｐ，Ｖ，Ｃｒ，Ｍｎ，Ｚｎ，Ｇａ，Ｇｅ，Ｓｅ，Ｂｒ，Ｚｒ，Ｎｂ，Ｍｏ，Ｒｕ，Ｐｄ，Ａｇ，Ｉｎ，Ｓｎ，Ｓｂ，Ｔｅ，Ｉ，Ｈｆ，Ｔａ，Ｗ，Ｐｔ，Ａｕ，Ｐｂ，Ｂｉの少なくとも１つで構成される添加元素を含む。【選択図】図２