RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To provide a composition providing a resin film which has high adhesive force, small dielectric loss and small warpage, a resin film obtained from the composition, a semiconductor laminate having a cured product of the resin film and a method for manufacturing the semiconductor laminate, and a semiconductor device obtained by individualizing the semiconductor laminate and a method for manufacturing the semiconductor device.SOLUTION: A resin composition is provided which includes an epoxy resin (A) having an epoxy equivalent of 140-5,000 g/eq, a phenolic curing agent (B), a curing accelerator (C), a modifier (D) that is a compound represented by the following formula (D), and an inorganic filler (E). In the formula, R is a hydrocarbyl group having 10 to 50 carbon atoms; Q is an ether bond, an ester bond, and a carbonyl group or a thioether bond; L is a hydrocarbyl group having 1 to 20 carbon atoms that may include an oxygen atom; and T is a reactive functional group. m is an integer of 1 to 3, when m is 2 or 3, each of L and each of T may be the same or different.SELECTED DRAWING: None 【課題】接着力が高く、誘電損失が小さく、反りが小さい樹脂フィルムを与える組成物、該組成物から得られる樹脂フィルム、該樹脂フィルムの硬化物を備える半導体積層体及びその製造方法、並びに該半導体積層体が個片化されたものである半導体装置及びその製造方法を提供する。【解決手段】（Ａ）エポキシ当量が１４０〜５,０００ｇ／ｅｑであるエポキシ樹脂、（Ｂ）フェノール系硬化剤、（Ｃ）硬化促進剤、（Ｄ）下記式（Ｄ）で表される化合物である改質剤、及び（Ｅ）無機充填剤を含む樹脂組成物。（式中、Ｒは、炭素数１０〜５０のヒドロカルビル基、Ｑは、エーテル結合、エステル結合、カルボニル基又はチオエーテル結合、Ｌは、酸素原子を含んでいてもよい炭素数１〜２０のヒドロカルビレン基、Ｔは、反応性官能基である。ｍは、１〜３の整数であり、ｍが２又は３のとき、各Ｌ及び各Ｔは、互いに同一であってもよく、異なっていてもよい。）【選択図】なし