RESIN MOLDING APPARATUS AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT

To provide a resin molding apparatus and a method for producing a resin molded product, that can grasp transfer output more accurately.SOLUTION: The resin molding apparatus comprises: a molding tool; plunger columns 641, 643 configured to allow transfer of resin to the molding tool; a detector 66 co...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO HARUAKI, NISHIHIRA TAKANORI, HARA AKIYOSHI, ICHIHASHI HIDEO, TAKEUCHI SHIN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To provide a resin molding apparatus and a method for producing a resin molded product, that can grasp transfer output more accurately.SOLUTION: The resin molding apparatus comprises: a molding tool; plunger columns 641, 643 configured to allow transfer of resin to the molding tool; a detector 66 configured to allow detection of detected values for the transfer output of the plunger columns 641, 643; and a control part 68 configured to allow control of the transfer output. The resin molding apparatus is configured so that the number of the plunger columns 641, 643 can be applied to either a single number or a plurality of columns. The control part 68 is configured to be able to switch a calibration value for calibrating the detected values detected by the detector so as to generate the transfer output according to the number of columns of the plunger columns 641, 643.SELECTED DRAWING: Figure 10 【課題】トランスファ出力をより正確に把握することが可能な樹脂成形装置および樹脂成形品の製造方法を提供する。【解決手段】樹脂成形装置は、成形型と、成形型に樹脂を移送可能に構成されたプランジャ列６４１，６４３と、プランジャ列６４１，６４３のトランスファ出力に関する検出値を検出可能に構成された検出器６６と、トランスファ出力を制御可能に構成された制御部６８と、を備えている。樹脂成形装置は、プランジャ列６４１，６４３の列数を単数または複数のいずれにも適用可能に構成されている。制御部６８は、プランジャ列６４１，６４３の列数に応じて、トランスファ出力を生成するように、検出器により検出された検出値を校正する校正値を切り替え可能に構成されている。【選択図】図１０