SYSTEM FOR ADJUSTING SURFACE TEMPERATURE OF PAD, AND POLISHING DEVICE

To provide a pad temperature adjustment system capable of accurately controlling a flow rate of a liquid flowing through a liquid supply line.SOLUTION: A system 5 includes a heat exchange member 11 and a liquid supply unit 30. The liquid supply unit 30 comprises a pump unit 32 for adjusting a flow r...

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Bibliographische Detailangaben
Hauptverfasser:	MARUYAMA TORU, KOMATSU MITSUNORI, UOZUMI SHUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a pad temperature adjustment system capable of accurately controlling a flow rate of a liquid flowing through a liquid supply line.SOLUTION: A system 5 includes a heat exchange member 11 and a liquid supply unit 30. The liquid supply unit 30 comprises a pump unit 32 for adjusting a flow rate of a liquid flowing through a heating liquid supply line HSL, a needle valve MNV that is attached to a cooling liquid supply line CSL, and a controller 40 for controlling operations of the pump unit 32 and the needle valve MNV.SELECTED DRAWING: Figure 1 【課題】液体供給ラインを流れる液体の流量を精度よく制御することができるパッド温度調節システムを提供する。【解決手段】システム５は、熱交換部材１１と、液体供給ユニット３０と、を備える。液体供給ユニット３０は、加熱液供給ラインＨＳＬを流れる液体の流量を調整するポンプ装置３２と、冷却液供給ラインＣＳＬに取り付けられたニードルバルブＭＮＶと、ポンプ装置３２およびニードルバルブＭＮＶの動作を制御する制御装置４０と、を備えている。【選択図】図１