SUBSTRATE FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

To provide a substrate for a semiconductor device in which a structure of each part of the acquired semiconductor device can be optimized, and the semiconductor device can be manufactured efficiently by providing a regulation part at an appropriate location.SOLUTION: In a substrate for a semiconduct...

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Bibliographische Detailangaben
Hauptverfasser: GOROMARU YUYA, HAYASHIDA MASAYUKI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a substrate for a semiconductor device in which a structure of each part of the acquired semiconductor device can be optimized, and the semiconductor device can be manufactured efficiently by providing a regulation part at an appropriate location.SOLUTION: In a substrate for a semiconductor device, a metal part that is at least an electrode part is formed on a mother mold substrate. A regulation part that regulates a semiconductor element is provided on the mother mold substrate. An extension part is formed on the upper part of the regulation part. The extension part is connected to an electrode of a semiconductor element. With such a configuration, misalignment of the semiconductor element can be prevented in the manufacture of the semiconductor device using the substrate for the semiconductor device.SELECTED DRAWING: Figure 13 【課題】適切な箇所に規制部を設け、得られる半導体装置各部の構造を最適化できるとともに、効率よく半導体装置を製造できる、半導体装置用基板を提供する。【解決手段】母型基板上に少なくとも電極部となる金属部が形成される半導体装置用基板であって、母型基板上には半導体素子を規制する規制部が設けられており、規制部の上部に延設部が形成され、該延設部が半導体素子の電極と接続される。係る構成により、半導体装置用基板を用いた半導体装置の製造にあたり、半導体素子の位置ズレを防止することができる。【選択図】図13