PLANAR HEATING ELEMENT

To provide a planar heating element capable of suppressing occurrence of breaks and cracks due to deformation.SOLUTION: A planar heating element 1A includes: a resin film 10; and a heater part 20A including a conductive circuit 30A formed on the resin film 10. The resin film 10 includes at least one...

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Bibliographische Detailangaben
Hauptverfasser: KAMESHIMA TAKASHI, NOMACHI KENTARO, KAIZU MASAHIRO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a planar heating element capable of suppressing occurrence of breaks and cracks due to deformation.SOLUTION: A planar heating element 1A includes: a resin film 10; and a heater part 20A including a conductive circuit 30A formed on the resin film 10. The resin film 10 includes at least one of a plurality of openings 11A-11F penetrating through the resin film 10 and arranged to surround a specific point SP and a plurality of recesses 12A-12G. The openings 11A-11F are arranged outside a circular area CA with a predetermined radius centered on the specific point SP on the resin film 10 and within the conductive circuit 30A. The recesses 12A-12G are recessed toward an inside of the resin film 10 and arranged on an outer periphery of the resin film 10.SELECTED DRAWING: Figure 1 【課題】変形に伴う折れや亀裂の発生の抑制を図ることができる面状発熱体を提供する。【解決手段】面状発熱体1Aは、樹脂フィルム10と、樹脂フィルム10上に形成された導電性回路30Aを含むヒータ部20Aと、を備え、樹脂フィルム10は、樹脂フィルム10を貫通すると共に、特定点SPを囲むように配置されている複数の開口部11A〜11F及び複数の凹部12A〜12Gの少なくとも一方を含んでおり、複数の開口部11A〜11Fは、樹脂フィルム10上の特定点SPを中心とした所定半径の円領域CAの外側であり且つ導電性回路30A内に配置されており、複数の凹部12A〜12Gは、樹脂フィルム10の内側に向かって凹んでいると共に、樹脂フィルム10の外周に配置されている。【選択図】 図1