IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT

To provide an imaging element capable of reducing the wiring capacity, and a method for manufacturing the imaging element.SOLUTION: An imaging element according to one embodiment comprises: a first wiring layer having a plurality of first wirings extending in one direction; a first insulating film l...

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Bibliographische Detailangaben
Hauptverfasser:	HANEDA MASAKI, KAMESHIMA TAKASUE, OTANI SHOGO, MIHASHI IKUE, MOCHIZUKI KENYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide an imaging element capable of reducing the wiring capacity, and a method for manufacturing the imaging element.SOLUTION: An imaging element according to one embodiment comprises: a first wiring layer having a plurality of first wirings extending in one direction; a first insulating film laminated to the first wiring layer and forming a gap between adjacent first wirings; a second insulating film that is laminated to the first insulating film and has a flat surface; and a first electroconductive film facing at least a portion of the first wirings across the first insulating film and the second insulating film.SELECTED DRAWING: Figure 1 【課題】配線容量を低減させることが可能な撮像素子および撮像素子の製造方法を提供する。【解決手段】本開示の一実施形態の撮像素子は、一方向に延伸する複数の第１の配線を有する第１の配線層と、第１の配線層に積層され、隣り合う複数の第１の配線の間に空隙を形成する第１の絶縁膜と、第１の絶縁膜に積層されると共に、表面が平坦な第２の絶縁膜と、第１の絶縁膜および第２の絶縁膜を間に、複数の第１の配線の少なくとも一部と正対する第１の導電膜とを備える。【選択図】図１