DICING/DIE BONDING INTEGRAL FILM AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a dicing/die bonding integral film comprising a pressure-sensitive adhesive layer having excellent pickup performance.SOLUTION: A film 10 comprise: a substrate layer 1; a pressure-sensitive adhesive layer 3 having a first surface F1 facing the substrate layer 1 and a second surface F2 on...

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Bibliographische Detailangaben
Hauptverfasser:	MORI SHUICHI, KIMURA HISAHIRO, TAZAWA TSUYOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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