FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD

To provide a flexible printed circuit board which is improved in heat dissipation and location accuracy, and a manufacturing method of the flexible printed circuit board.SOLUTION: The presented invention relates to a flexible printed circuit board successively comprising at least a metal plate, an adhesive layer, a base material layer and a conductor in which a circuit pattern is formed. In the flexible printed circuit board, heat conductivity λ1 of the base material layer is 0.43 W/m K or more, the metal plate has a thickness of 0.5 mm or more and heat conductivity λ2 of the adhesive layer is 0.43 W/m K or more. The present invention also relates to a flexible printed circuit board successively comprising at least a support layer, a base material layer and a conductor in which a circuit pattern is formed. In the flexible printed circuit board, heat conductivity λ1 of the base material layer is 0.43 W/m K or more, and an interface between the base material layer and the support layer in the flexible printed circuit board is detachable. The present invention further relates to a manufacturing method of the flexible printed circuit board.SELECTED DRAWING: Figure 2 【課題】放熱性及び位置精度に優れたフレキシブルプリント基板及びフレキシブルプリント基板の製造方法を提供する。【解決手段】フレキシブルプリント基板であって、少なくとも金属板、接着剤層、基材層及び回路パターンが形成された導体をこの順に有し、基材層の熱伝導率λ１が０．４３Ｗ／ｍ・Ｋ以上であり、金属板が０．５ｍｍ以上の厚みを有し、接着剤層の熱伝導率λ２が０．４３Ｗ／ｍ・Ｋ以上であるフレキシブルプリント基板、及び、フレキシブルプリント基板であって、少なくとも支持層、基材層及び回路パターンが形成された導体をこの順に有し、基材層の熱伝導率λ１が０．４３Ｗ／ｍ・Ｋ以上であり、フレキシブルプリント基板における基材層と支持層との界面が剥離可能であるフレキシブルプリント基板、並びに、フレキシブルプリント基板の製造方法。【選択図】図２