n-TYPE GaN CRYSTAL, GaN WAFER, AND GaN CRYSTAL, GaN WAFER AND NITRIDE SEMICONDUCTOR DEVICE PRODUCTION METHOD

To fulfill the following demand: if GaN crystals having a (004) XRD rocking curve FWHM of 20 arcsec or less, which is equivalent to that of GaN crystals grown by the ammonothermal method, can be grown by HVPE with high productivity, it is expected to contribute to promoting the development of nitrid...

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Hauptverfasser: ISO KENJI, MOCHIZUKI TAE, TAKAHASHI TATSUYA, ENATSU YUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To fulfill the following demand: if GaN crystals having a (004) XRD rocking curve FWHM of 20 arcsec or less, which is equivalent to that of GaN crystals grown by the ammonothermal method, can be grown by HVPE with high productivity, it is expected to contribute to promoting the development of nitride semiconductor devices produced using c-plane GaN wafers as substrates and a reduction in cost.SOLUTION: In this n-type GaN crystal, the donor dopant contained at the highest concentration is Ge. The n-type GaN crystal has a resistivity at room temperature of less than 0.03 Ω cm and has a (004) XRD rocking curve FWHM of less than 20 arcsec. The n-type GaN crystal has two principal surfaces each having an area of 3 cm2 or more, and one of the surfaces has Ga polarity and is inclined at an angle of 0 to 10 degrees relative to the (0001) crystal plane. Additionally, the n-type GaN crystal has a diameter of 20 mm or more.SELECTED DRAWING: Figure 1 【課題】アモノサーマル法で成長されたGaN結晶に匹敵する20arcsec以下の(004)XRDロッキングカーブFWHMを持つGaN結晶を、量産性に優れたHVPEで成長させることができれば、c面GaNウエハを基板に用いて生産される窒化物半導体デバイスの開発促進や低コスト化に貢献できるものと期待される。【解決手段】n型GaN結晶は、最も高い濃度で含有するドナー不純物がGeであり、0.03Ω・cm未満の室温抵抗率を有し、その(004)XRDロッキングカーブFWHMは20arcsec未満である。このn型GaN結晶は、それぞれ面積が3cm2以上である2つの主面を有し、その一方はGa極性であって(0001)結晶面に対する傾斜が0度以上10度以下であり得る。更に、このn型GaN結晶は20mm以上の直径を有し得る。【選択図】図1