METHOD FOR MANUFACTURING ELECTRODE FOIL FOR ELECTROLYTIC CAPACITOR

To form uniform etching pits in metal foil.SOLUTION: A method for manufacturing electrode foil for an electrolytic capacitor comprises an electro-etching process for causing a current to flow through at least one principal face of metal foil in an etchant to etch the metal foil. The electro-etching...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKANO SHOSUKE, YOSHIMURA MITSUHISA, YOSHIDA HIROSHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To form uniform etching pits in metal foil.SOLUTION: A method for manufacturing electrode foil for an electrolytic capacitor comprises an electro-etching process for causing a current to flow through at least one principal face of metal foil in an etchant to etch the metal foil. The electro-etching process comprises: a first step of etching the metal foil until 30% of a total time T during which the metal foil is etched has elapsed from start of etching the metal foil; and a second step of etching the metal foil after the first step. The first step includes an operation of causing a current through the metal foil so that a maximum current density is A1. The second step includes flowing a current through the metal foil for 50% of the total time T or longer time so as to make a current density 10-30% of the maximum current density A1.SELECTED DRAWING: Figure 2A 【課題】金属箔に均一なエッチングピットを形成する。【解決手段】エッチング液中において金属箔の少なくとも一方の主面に電流を流して、前記金属箔をエッチングする電解エッチング工程を備え、前記電解エッチング工程は、前記金属箔のエッチングが開始されてから前記金属箔がエッチングされる総時間Tの30%が経過するまで、前記金属箔をエッチングする第1ステップと、前記第1ステップ後、前記金属箔をエッチングする第2ステップと、を備え、前記第1ステップは、前記金属箔に最大電流密度がA1となるように電流を流すことを含み、前記第2ステップは、前記総時間Tの50%以上の時間、前記金属箔に、電流密度が前記最大電流密度A1の10%以上30%以下になるように電流を流すことを含む、電解コンデンサ用電極箔の製造方法。【選択図】図2A