RESIN COMPOSITION AND CURED FILM THEREOF

To provide a resin composition showing a low refractive index and excellent application properties.SOLUTION: A resin composition contains (A) polysiloxane and (B) a ketone compound. In the (A) polysiloxane, relative to silicon atoms 100 mol%, 20-50 mol% of a fluorinated alkyl group with 9-21 fluorin...

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Bibliographische Detailangaben
Hauptverfasser:	SUWA MITSUFUMI, HIBINO TOSHIYASU, NARUTO MASAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a resin composition showing a low refractive index and excellent application properties.SOLUTION: A resin composition contains (A) polysiloxane and (B) a ketone compound. In the (A) polysiloxane, relative to silicon atoms 100 mol%, 20-50 mol% of a fluorinated alkyl group with 9-21 fluorine atoms and 6-12 carbon atoms are contained. In the resin composition 100 mass%, 50 mass% or more of the (B) ketone compound is contained.SELECTED DRAWING: None 【課題】低屈折率かつ優れた塗布性を示す樹脂組成物を提供すること。【解決手段】（Ａ）ポリシロキサン、及び（Ｂ）ケトン系化合物を含む樹脂組成物であって、前記（Ａ）ポリシロキサンのケイ素原子１００モル％中に、フッ素数９〜２１及び炭素数６〜１２のフッ化アルキル基を２０〜５０モル％含み、前記樹脂組成物１００質量％中に、（Ｂ）ケトン系化合物を５０質量％以上含む、樹脂組成物。【選択図】なし