CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE ARRANGED BY USE THEREOF

To provide a ceramic metal circuit board which enables the increase in the adhesion with a mold resin.SOLUTION: A ceramic metal circuit board comprises a metal part provided on at least one face of a ceramic substrate. In at least one portion of the face with the metal part provided thereon, a concave portion having a depth of from 5% up to 70% of a thickness of the ceramic substrate is provided at a place where the metal part is not provided. It is preferred that the total area of the concave portion provided at the place in the portion of the face with the metal part provided thereon, where the metal part is not provided is 0.1% to 50% of that of a portion of the face with the metal part provided thereon, where the metal part is not provided.SELECTED DRAWING: Figure 1 【課題】 モールド樹脂との密着性を向上させることができるセラミックス金属回路基板を提供する。【解決手段】セラミクス基板の少なくとも一方の面に金属部を設けたセラミックス金属回路基板において、金属部を設けた面の少なくとも一方には金属部を設けていない箇所に、セラミックス基板の厚さの５％以上７０％以下の深さを有する凹部を設けたことを特徴とする。また、前記金属部を設けた面の金属部を設けていない箇所に設けられた凹部の合計面積は前記金属部を設けた面の金属部を設けていない箇所の０．１％以上５０％以下であることが好ましい。【選択図】図１