THERMOELECTRIC MODULE AND MANUFACTURING METHOD THEREOF

To provide a thermoelectric module with improved durability.SOLUTION: A thermoelectric module 1 includes a set of two substrates 10, an electrode 30 that is electrically connected to a thermoelectric element 20, a storage chamber 40 that accommodates the thermoelectric element 20 to which the electr...

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Bibliographische Detailangaben
Hauptverfasser: UCHIDA KENTARO, TSURUMI SHIGEYUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a thermoelectric module with improved durability.SOLUTION: A thermoelectric module 1 includes a set of two substrates 10, an electrode 30 that is electrically connected to a thermoelectric element 20, a storage chamber 40 that accommodates the thermoelectric element 20 to which the electrode 30 is electrically connected, and a viscous contact layer 50 that brings the substrate 10 into contact with the electrode 30. The viscous contact layer 50 is a layer formed of a silicone oil compound having a thermal conductivity of 0.7 or more and a viscosity that maintains a state in which the substrate 10 and the electrode 30 are in contact with each other. Further, the pressure inside the storage chamber 40 is lower than the pressure outside the storage chamber. A sealing material 400 is in contact with the substrate 10 by the viscous contact layer 50.SELECTED DRAWING: Figure 3 【課題】 耐久性を向上させた熱電モジュールを提供する。【解決手段】熱電モジュール1は、2枚一組の基板10と、熱電素子20を電気的に接続した電極30と、電極30を電気的に接続した熱電素子20を収容する収容室40と、基板10及び電極30を接触させる粘性接触層50とを有する。粘性接触層50は、熱伝導率0.7以上であり、かつ、基板10及び電極30が接触した状態を維持する粘度を有するのシリコーンオイルコンパウンドにより形成された層である。また、収容室40の内部の圧力は、当該収容室の外部の圧力より低い。封止材400は、粘性接触層50により、基板10と接触している。【選択図】図3