WAFER PROCESSING METHOD

To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed into individual device chips comprises a polyolefin-based sheet arranging step, an integrating step, a dividing step, and a picking-up step. The pol...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAKAWA TARO, KAWAMURA SUMIKO, OMAE MAKIKO, YODO YOSHIAKI, MIYAI TOSHITERU, FUJII YUSUKE, MATSUZAWA MINORU, UENO MASAMITSU, HARADA SHIGENORI, KIUCHI ITSUTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!