COMPOSITION FOR POLISHING, AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE

To provide a composition for polishing that is used for polishing Ni-P substrates and has excellent scratch reduction performance while maintaining a practical polishing rate.SOLUTION: According to the present invention, a composition for polishing that is used for polishing a Ni-P substrate is prov...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MATSUBARA KAZUKI, OYAMA TAKAHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a composition for polishing that is used for polishing Ni-P substrates and has excellent scratch reduction performance while maintaining a practical polishing rate.SOLUTION: According to the present invention, a composition for polishing that is used for polishing a Ni-P substrate is provided. The composition for polishing contains silica particles, an acid, an oxidizing agent, a water-soluble polymer, and water. The composition for polishing contains, as the water-soluble polymer, a first water-soluble polymer having an anionic functional group and a second water-soluble polymer having a cationic functional group.SELECTED DRAWING: None 【課題】Ｎｉ−Ｐ基板の研磨に用いられて、実用的な研磨速度を維持しながら、優れたスクラッチ低減性能を有する研磨用組成物を提供すること。【解決手段】本発明によると、Ｎｉ−Ｐ基板の研磨に用いられる研磨用組成物が提供される。上記研磨用組成物は、シリカ粒子と、酸と、酸化剤と、水溶性高分子と、水とを含む。上記研磨用組成物は、上記水溶性高分子として、アニオン性官能基を有する第１の水溶性高分子と、カチオン性官能基を有する第２の水溶性高分子とを含む。【選択図】なし