COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

To provide a component module which can be easily downsized.SOLUTION: A component module comprises: a sub-module having a first insulation layer, a first electronic component which is bonded to an upper face of the first insulation layer and has a plurality of electrodes on a lower face thereof, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUKAWA TAKASHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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