COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

To provide a component module which can be easily downsized.SOLUTION: A component module comprises: a sub-module having a first insulation layer, a first electronic component which is bonded to an upper face of the first insulation layer and has a plurality of electrodes on a lower face thereof, and a first metal layer which is provided on a lower face of the first insulation layer and is electrically connected to the plurality of electrodes via first through-holes penetrating the first insulation layer; a second insulation layer to an upper face of which the sub-module is bonded; a second electronic component which is bonded to the upper face of the second insulation layer without via the first insulation layer; an adhesive which bonds the sub-module and the second electronic component to the second insulation layer; and a second metal layer which is provided on a lower face of the second insulation layer, and is electrically connected to the first metal layer and the second electronic component via second through-holes penetrating the second insulation layer and the adhesive.SELECTED DRAWING: Figure 4 【課題】簡単に小型化すること。【解決手段】第１絶縁層と、前記第１絶縁層の上面に接合され下面に複数の電極を有する第１電子部品と、前記第１絶縁層の下面に設けられ、前記第１絶縁層を貫通する第１貫通孔を介し前記複数の電極に電気的に接続された第１金属層と、を備えるサブモジュールと、上面に前記サブモジュールが接合された第２絶縁層と、前記第１絶縁層を介さず前記第２絶縁層の上面に接合された第２電子部品と、前記サブモジュールおよび前記第２電子部品と前記第２絶縁層とを接合する接着剤と、前記第２絶縁層の下面に設けられ、前記第２絶縁層および前記接着剤を貫通する第２貫通孔を介し前記第１金属層および前記第２電子部品に電気的に接続された第２金属層と、を備える部品モジュール。【選択図】図4