PHOTOCURABLE RESIN COMPOSITION FOR ELECTRONIC DEVICES

To provide a photocurable resin composition for electronic devices which is excellent in coatability, curability, and low outgassing properties and has a low dielectric constant.SOLUTION: The photocurable resin composition for electronic devices contains a curable resin and a polymerization initiator. The curable resin contains a monofunctional cationically polymerizable compound and a polyfunctional cationically polymerizable compound. The monofunctional cationically polymerizable compound contains at least one of a monofunctional aliphatic cationically polymerizable compound and a monofunctional cationically polymerizable compound having an optionally substituted phenoxy group. The polyfunctional cationically polymerizable compound contains a silicone compound having two or more cationically polymerizable groups. The photocurable resin composition for electronic devices has a dielectric constant of 3.5 or less as measured under conditions of 25°C and 100 kHz.SELECTED DRAWING: None 【課題】塗布性、硬化性、及び、低アウトガス性に優れ、かつ、低い誘電率を有する電子デバイス用光硬化性樹脂組成物を提供する。【解決手段】硬化性樹脂と重合開始剤とを含有する電子デバイス用光硬化性樹脂組成物であって、前記硬化性樹脂は、単官能カチオン重合性化合物と多官能カチオン重合性化合物とを含み、前記単官能カチオン重合性化合物は、単官能脂肪族カチオン重合性化合物、及び、置換されていてもよいフェノキシ基を有する単官能カチオン重合性化合物の少なくともいずれかを含み、前記多官能カチオン重合性化合物は、２以上のカチオン重合性基を有するシリコーン化合物を含み、２５℃、１００ｋＨｚの条件で測定した誘電率が、３．５以下である電子デバイス用光硬化性樹脂組成物。【選択図】なし