HEAT INSULATING PANEL

To provide a heat insulating panel having lower heat conduction than before.SOLUTION: A heat insulating panel is formed by compressive-molding a heat insulating material whose main material is a calcium silicate heat insulating material, wherein more than 0 wt.% and 40 wt.% or less of silica aerogel...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI KAZUHIRO, YAMASHIRO HIROTAKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BLASTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	To provide a heat insulating panel having lower heat conduction than before.SOLUTION: A heat insulating panel is formed by compressive-molding a heat insulating material whose main material is a calcium silicate heat insulating material, wherein more than 0 wt.% and 40 wt.% or less of silica aerogel is mixed in the heat insulating material, and assuming that the entire heat insulating material is 100%, cellulose nanofibers are contained in it within a range of 0 wt.% or more to 4 wt.% or less.SELECTED DRAWING: Figure 1 【課題】従来よりも熱伝導の低い断熱パネルを提供する。【解決手段】ケイ酸カルシウム保温材を主材とする断熱材を圧縮成形した断熱パネルであって、断熱材にシリカエアロゲルを０ｗｔ％よりも多く且つ４０ｗｔ％以下混入し、断熱材全体を１００％として、その中に、セルロースナノファイバーを、０ｗｔ％以上〜４ｗｔ％以下含有する。【選択図】図１