EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

To provide an epoxy resin composition having excellent adhesiveness.SOLUTION: An epoxy resin composition has an epoxy resin, a curing agent and a curing accelerator. In a measurement using a rheometer at 140°C and a rotation frequency of 5 rad/s, with a viscosity after 20 seconds from the start of m...

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Bibliographische Detailangaben
Hauptverfasser:	FUSUMADA MITSUAKI, KANG DONGOL, NAKAMURA SHINYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide an epoxy resin composition having excellent adhesiveness.SOLUTION: An epoxy resin composition has an epoxy resin, a curing agent and a curing accelerator. In a measurement using a rheometer at 140°C and a rotation frequency of 5 rad/s, with a viscosity after 20 seconds from the start of measurement defined as Viscosity A and a viscosity after 40 seconds defined as Viscosity B, a rate of rise in Viscosity B to Viscosity A is 200% or less.SELECTED DRAWING: None 【課題】接着性に優れるエポキシ樹脂組成物の提供。【解決手段】エポキシ樹脂組成物は、エポキシ樹脂と硬化剤と硬化促進剤とを含有し、レオメータを用い、１４０℃、回転周波数５ｒａｄ／ｓで測定した際の、測定開始より２０秒後の粘度を粘度Ａとし、４０秒後の粘度を粘度Ｂとしたときに、粘度Ａに対する粘度Ｂの上昇率が、２００％以下のものである。【選択図】なし