RESIN FILM

To provide a resin film excellent in rigidity and strength, low in moisture permeability, and excellent in production efficiency.SOLUTION: A resin film of the present invention comprises an ultra-high molecular weight polyethylene resin (A), a thermoplastic resin (B), and a condensed hydroxy fatty a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAMAGUCHI KIYOTAKA, MORI TOYOICHIRO, ARITOME NORIFUMI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a resin film excellent in rigidity and strength, low in moisture permeability, and excellent in production efficiency.SOLUTION: A resin film of the present invention comprises an ultra-high molecular weight polyethylene resin (A), a thermoplastic resin (B), and a condensed hydroxy fatty acid and/or its alcohol ester (C), in which (i) a thickness is 10 μm to 500 μm, (ii) a degree of crystal orientation is 0.94 or larger, (iii) a tensile strength at 23°C is 100 MPa or larger, (iv) the tensile modulus at 23°C is 3000 MPa or larger, (v) 30 μm conversion moisture vapor permeability is 10 g/m2 d or smaller, and, (vi) DSC measurement has an endothermic peak of smaller than 140°C, and an endothermic peak of 140°C or higher.SELECTED DRAWING: None 【課題】剛性および強度に優れ、低透湿であり、かつ、生産効率に優れた樹脂フィルムを提供すること。【解決手段】本発明の樹脂フィルムは、超高分子量ポリエチレン樹脂(A)と、熱可塑性樹脂(B)と、縮合ヒドロキシ脂肪酸および/またはそのアルコールエステル(C)とを含み、(i)厚みが10μm〜500μmであり、(ii)結晶配向度が0.94以上であり、(iii)23℃における引張強度が100MPa以上であり、(iv)23℃における引張弾性率が3000MPa以上であり、(v)30μm換算透湿度が10g/m2・d以下であり、かつ、(vi)DSC測定において、140℃未満の吸熱ピークと、140℃以上の吸熱ピークとを有する。【選択図】なし