SEMICONDUCTOR DEVICE

To provide a semiconductor device that can secure the reliability by preventing the inclination of a semiconductor chip due to the wettability of solder.SOLUTION: A semiconductor device includes: an insulating circuit board 2; a chip connection member 3 disposed on a conductive layer 21 provided on an upper surface of the insulating circuit board 2; a semiconductor chip having a back surface bonded by the chip connection member 3 and including a first electrode pad 15 on one end side and a second electrode pad 16 on the other end side, the second electrode pad 16 allowing larger current to flow than the first electrode pad 15; a first connection pin 5 press-fitted in a first penetration hole 25 provided to a wiring board 7 opposite to the insulating circuit board 2 and having one end bonded to a first solder material 4a disposed on the first electrode pad 15; and a second connection pin 6 press-fitted in a second penetration hole 26 provided to the wiring board 7 and having one end bonded to a second solder material 4b disposed on the second electrode pad 16. A first plating layer of the first connection pin 5 has higher solder wettability than a second plating layer of the second connection pin.SELECTED DRAWING: Figure 1 【課題】はんだの濡れ性に起因する半導体チップの傾斜を防止することができ、信頼性の確保が可能な半導体装置を提供する。【解決手段】絶縁回路基板２と、絶縁回路基板２の上面に設けられた導電層２１の上に配置されたチップ接続部材３と、チップ接続部材３により裏面が接合され、一端側に第１電極パッド１５と他端側に第１電極パッド１５よりも大電流が流れる第２電極パッド１６とを有する半導体チップと、絶縁回路基板２に対面する配線基板７に設けられた第１貫通孔２５に圧入され、第１電極パッド１５の上に配置された第１はんだ材４ａに一端が接合された第１接続ピン５と、配線基板７に設けられた第２貫通孔２６に圧入され、第２電極パッド１６の上に配置された第２はんだ材４ｂに一端が接合された第２接続ピン６とを備える。第１接続ピン５の第１めっき層は、第２接続ピンの第２めっき層よりはんだの濡れ性が高い。【選択図】図１