HEAT-DISSIPATING MATERIAL, MANUFACTURING METHOD OF THE SAME, AND HEAT-GENERATING BODY

To provide a heat-dissipating material that excels in dissipating the heat generated by a heat-generating body and has excellent adhesiveness to an adherend, a manufacturing method of the same, and a heat-generating body provided with the heat-dissipating material.SOLUTION: The heat-dissipating mate...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI MASANORI, TAKEZAWA YOSHITAKA, ANDO TAKUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a heat-dissipating material that excels in dissipating the heat generated by a heat-generating body and has excellent adhesiveness to an adherend, a manufacturing method of the same, and a heat-generating body provided with the heat-dissipating material.SOLUTION: The heat-dissipating material has a base material layer that has resin and has an uneven structure on at least one surface and a metal layer that is disposed on the surface of the base material layer with the uneven structure thereon and has a shape corresponding to the uneven structure.SELECTED DRAWING: None 【課題】発熱体から生じた熱の放熱性に優れ、かつ被着体への密着性に優れる放熱材及びその製造方法、並びに前記放熱材を備える発熱体の提供。【解決手段】樹脂を含み、少なくとも一方の面に凹凸構造を有する基材層と、前記基材層の前記凹凸構造を有する面側に配置され、かつ前記凹凸構造に対応する形状を有する金属層と、を有する放熱材。【選択図】なし