LAMINATED CURED PRODUCT, CURABLE RESIN COMPOSITION, DRY FILM, AND MANUFACTURING METHOD OF LAMINATED CURED PRODUCT

To provide a cured product layer that achieves both of embedding property and insulation reliability, a curable resin composition used for the cured product layer, a dry film made of the curable resin composition, and a manufacturing method of the cured product layer.SOLUTION: In a laminated cured product or the like in which a (A) first cured product layer composed of a first curable resin composition and a (B) second cured product layer composed of a second curable resin composition are sequentially laminated on a circuit board, the thickness of the (A) first cured product layer is thinner than the thickness of a connection circuit of the circuit board, the (B) second cured product layer includes an inorganic filler, and the (A) first cured product layer does not include an inorganic filler or includes a smaller amount of an inorganic filler than that of the (B) second cured product layer.SELECTED DRAWING: Figure 1 【課題】埋め込み性と絶縁信頼性を両立した硬化物層、該硬化物層に用いる硬化性樹脂組成物、該硬化性樹脂組成物からなるドライフィルム、および、該硬化物層の製造方法を提供する。【解決手段】回路基板上に、第１硬化性樹脂組成物からなる（Ａ）第１硬化物層と、第２硬化性樹脂組成物からなる（Ｂ）第２硬化物層が順に積層されている積層硬化体であって、前記（Ａ）第１硬化物層の厚みが前記回路基板の接続回路の厚みよりも薄く、前記（Ｂ）第２硬化物層が、無機フィラーを含有し、前記（Ａ）第１硬化物層が、無機フィラーを含有しないか、または、前記（Ｂ）第２硬化物層よりも少ない量で無機フィラーを含有することを特徴とする積層硬化体等である。【選択図】図１