METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

To provide a method for manufacturing a light-emitting device, by which a warp in a substrate can be suppressed.SOLUTION: A method for manufacturing a light-emitting device according to an embodiment hereof comprises: a substrate preparation step of preparing a substrate including a first region where a plurality of light-emitting devices are to be formed and a second region surrounding the first region; an element-setting step of setting a plurality of light-emitting elements in the first region; a reinforcement member-disposing step of disposing a reinforcement member on the second region; a seal member-forming step of forming and curing a seal member smaller, in rigidity, than the reinforcement member so as to be in contact with the reinforcement member and the light-emitting elements; and a dividing step of cutting the substrate, the reinforcement member and the seal member to make separation into the respective light-emitting devices.SELECTED DRAWING: Figure 11B 【課題】基板の反りを抑制することが可能な発光装置の製造方法を提供する。【解決手段】実施形態に係る発光装置の製造方法は、以下の工程を含む。複数の発光装置が形成される第１領域と、前記第１領域を囲む第２領域と、を備える基板を準備する基板準備工程と、前記第１領域に複数の発光素子を載置する素子載置工程と、前記第２領域上に補強部材を配置する補強部材配置工程と、前記補強部材及び前記発光素子と接するように前記補強部材よりも剛性の小さい封止部材を形成して硬化させる封止部材形成工程と、前記基板と、前記補強部材と、前記封止部材とを切断して個々の発光装置に分離する個片化工程と、を備える発光装置の製造方法。【選択図】図１１Ｂ