FORMATION METHOD OF METAL PLATING FILM

To provide a method of forming a metal plating film having a thick film thickness by a solid phase method.SOLUTION: A method of forming a metal plating film of a first metal and a second metal having an ionization tendency larger than that of the first metal according to the invention includes a first step where a second metal plating film is formed by precipitating the second metal on a surface of a copper substrate, and a second step where a first metal plating film is formed by precipitating the first metal on a surface of the second metal by a solid phase electroless plating method. The solid phase electroless plating method in the second step is performed using a laminated composite containing: a substitution type electroless plating bath containing a first metal ion; a solid electrolyte membrane; the copper substrate with the second metal plated thereon; a third metal having an ionization tendency larger than that of the second metal; a second substitution type electroless plating bath containing the first metal ion; and an insulating polymer.SELECTED DRAWING: Figure 6 【課題】固相法により厚い膜厚を有する金属めっき皮膜を形成する方法を提供する。【解決手段】本発明は、第１の金属及び第１の金属よりもイオン化傾向が大きい第２の金属の金属めっき皮膜を形成する方法であって、第２の金属を銅基材の表面上に析出させて第２の金属のめっき皮膜を形成する第１の工程、及び第１の金属を固相無電解めっき法により第２の金属の表面上に析出させて第１の金属のめっき皮膜を形成する第２の工程を含み、第２の工程における固相無電解めっき法を、第１の金属のイオンを含む第１の置換型無電解めっき浴と、固体電解質膜と、第２の金属がめっきされた銅基材と、第２の金属よりもイオン化傾向が大きい第３の金属と、第１の金属のイオンを含む第２の置換型無電解めっき浴と、絶縁性高分子とを含む積層複合体を用いて実施する、方法に関する。【選択図】図６