ELECTRONIC COMPONENT MOUNTING STRUCTURE

To provide an electronic component mounting structure capable of achieving component heat generation and equalization of current values for each of a plurality of electronic components.SOLUTION: In an electronic component mounting structure 1, each first spatial distance group between an anode conne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAGITA KAZUHIRO, ISHIKAWA YOSHIAKI, MORITSUGU MASAHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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