PROCESSING METHOD FOR WORKPIECE

To provide a new processing method for a workpiece, which is used in processing a plate-like workpiece.SOLUTION: A processing method for a workpiece is used when a plate-like workpiece is processed in a planned processing area set for the workpiece. The processing method includes: a metal plate arra...

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Bibliographische Detailangaben
Hauptverfasser: OTAKE YUSUKE, TAKAHASHI KUNIMITSU, KIRIBAYASHI YUKIHIRO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a new processing method for a workpiece, which is used in processing a plate-like workpiece.SOLUTION: A processing method for a workpiece is used when a plate-like workpiece is processed in a planned processing area set for the workpiece. The processing method includes: a metal plate arrangement step of mounting a metal plate large enough to cover the planned processing area on the upper surface side of the workpiece and thereby to cover the planned processing area with the metal plate; and a laser beam irradiation step of irradiating, from the upper surface side of the metal plate, a portion of the metal plate, the portion covering the planned processing area, with a laser beam with a wavelength absorbed by the metal plate. In the laser beam irradiation step, a portion of the metal plate, the portion covering the planned processing area, is processed by the laser beam, and also the planned processing area of the workpiece is processed by heat conducted from the metal plate.SELECTED DRAWING: Figure 3 【課題】板状の被加工物を加工する際に用いられる新たな被加工物の加工方法を提供する。【解決手段】板状の被加工物に設定された加工予定領域で被加工物を加工する際に用いられる被加工物の加工方法であって、加工予定領域を覆うことができる大きさの金属板を被加工物の上面側に載せて加工予定領域を金属板で覆う金属板配置ステップと、金属板に吸収される波長のレーザービームを金属板の上面側から金属板の加工予定領域を覆う部分に照射するレーザービーム照射ステップと、を含み、レーザービーム照射ステップでは、レーザービームにより金属板の加工予定領域を覆う部分を加工するとともに、金属板から伝導する熱により被加工物の加工予定領域を加工する。【選択図】図3