SUBSTRATE HOLDER, CARRIER SYSTEM CARRYING SUBSTRATE IN ELECTRONIC DEVICE MANUFACTURING INSTALLATION AND ELECTRONIC DEVICE MANUFACTURING INSTALLATION

To provide a carrier system which can carry a substrate having a warp state certainly.SOLUTION: A carrier system comprises an upper hand 237 that a substrate WF is put on. The upper hand 237 comprises a base 132 and at least one umbo 134 arranged on the face side of the base 132. The umbo 134 has a...

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1. Verfasser:	FUJIKATA JUNPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Zusammenfassung:	To provide a carrier system which can carry a substrate having a warp state certainly.SOLUTION: A carrier system comprises an upper hand 237 that a substrate WF is put on. The upper hand 237 comprises a base 132 and at least one umbo 134 arranged on the face side of the base 132. The umbo 134 has a vacuum hole to adsorb the substrate WF by a vacuum. The vacuum hole has an opening 138 on the top of the umbo 134. The hight of the top of the umbo 134 is fixed for the face side of the base 132. The substrate WF is adsorbed to the top of the umbo 134 by a vacuum.SELECTED DRAWING: Figure 10 【課題】反り状態を有した基板を確実に搬送することができる搬送システムを提供する。【解決手段】搬送システムは、基板ＷＦが搭載される上部ハンド２３７を備える。上部ハンド２７３が、基部１３２と、基部１３２の表面上に配置された少なくとも１つの突起部１３４とを備える。突起部１３４が、基板ＷＦを真空により吸着するための真空孔を有する。真空孔は、突起部１３４の頂部に開口１３８を有する。突起部１３４の頂部は、基部１３２の表面に対して高さが固定されている。突起部１３４の頂部に、基板ＷＦを真空により吸着する。【選択図】図１０