VACUUM INSULATION DOUBLE LAYER GLASS PANEL

To provide a vacuum insulation double layer glass panel capable of performing hermetic seal with high reliability and at a low temperature of less than 320°C, improving heat insulation by high vacuum of an inner space, improving mass productivity, reducing production cost by reduction of capital inv...

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Bibliographische Detailangaben
Hauptverfasser: MIYAKE TATSUYA, ISOHATA TAKAHIRO, WAKIGUCHI KEITA, AOYAGI TAKUYA, HASHIBA YUJI, ABE KOKI, NAITO TAKASHI, TACHIZONO SHINICHI, ONODERA TAIGO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a vacuum insulation double layer glass panel capable of performing hermetic seal with high reliability and at a low temperature of less than 320°C, improving heat insulation by high vacuum of an inner space, improving mass productivity, reducing production cost by reduction of capital investment cost, and improving safety properties.SOLUTION: A vacuum insulation double layer glass panel comprises: a first glass substrate; and a second glass substrate. A spacer and a sealing part are held between the first glass substrate and the second glass substrate, the sealing part is provided on peripheral parts of the first glass substrate and the second glass substrate, the spacer is arranged in a space surrounded by the first glass substrate, the second glass substrate and the sealing part. A pressure of the space is reduced, the sealing part includes a low melting point glass phase. The low melting point glass phase includes vanadium oxide, tellurium oxide, and lithium oxide, and has a second endotherm peak temperature by differential thermal analysis is equal to or smaller than 300°C.SELECTED DRAWING: Figure 1A 【課題】320℃未満の低温度で信頼性の高い気密封止が可能であり、内部空間の高真空化による断熱性の向上、量産性の向上及び設備投資費の削減による製造コストの低減、並びに安全性の向上を実現した真空断熱複層ガラスパネルを提供する。【解決手段】第1ガラス基板と、第2ガラス基板と、を備えた真空断熱複層ガラスパネルであって、第1ガラス基板と第2ガラス基板との間には、スペーサ及び封止部が挟み込まれ、封止部は、第1ガラス基板及び第2ガラス基板の周縁部に設けられ、スペーサは、第1ガラス基板、第2ガラス基板及び封止部で囲まれた空間に配置され、空間は、減圧された状態であり、封止部は、低融点ガラス相を含み、低融点ガラス相は、酸化バナジウム、酸化テルル及び酸化リチウムを含み、示差熱分析による第二吸熱ピーク温度が300℃以下である。【選択図】図1A