ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME, FILTER, AND MULTIPLEXER

To achieve miniaturization.SOLUTION: An electronic device comprises: a single support substrate 10 that has a first surface and a second surface opposed to the first surface; a function element provided on the first surface of the support substrate; a first metal layer 16a conductively connected wit...

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Bibliographische Detailangaben
Hauptverfasser: KURIHARA TOMO, YOSHITAKE HARUHIKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To achieve miniaturization.SOLUTION: An electronic device comprises: a single support substrate 10 that has a first surface and a second surface opposed to the first surface; a function element provided on the first surface of the support substrate; a first metal layer 16a conductively connected with the function element, buried in the support substrate, exposed to the first surface side, and formed so that its width becomes narrower from the first surface to the second surface; and a second metal layer 16b overlapped with the first metal layer in a plan view, being in contact with the first metal layer in the support substrate, buried in the support substrate, exposed to the second surface, and formed so as to have a minimum cross sectional area in the plan view larger than a cross sectional area of the first metal layer at a contact surface with the first metal layer.SELECTED DRAWING: Figure 1 【課題】小型化すること。【解決手段】第1面と前記第1面に向かい合う第2面とを有する単一の支持基板10と、前記支持基板の前記第1面上に設けられた機能素子と、前記機能素子との間が導電可能に接続され、前記支持基板に埋め込まれ前記第1面側に露出し前記第1面から前記第2面に向かうにしたがい幅が狭くなる第1金属層16aと、平面視において前記第1金属層と重なり、前記支持基板内において前記第1金属層と接し、前記支持基板に埋め込まれ前記第2面に露出し、平面視における最小の断面積が前記第1金属層と接する接触面における前記第1金属層の断面積より大きい第2金属層16bと、を備える電子デバイス。【選択図】図1