CIRCUIT BOARD MANUFACTURING METHOD AND JOINED BODY MANUFACTURING METHOD

To provide a manufacturing method of a circuit board that can obtain a circuit board and achieves both suppression of warpage during bonding with a base substrate and thermal conductivity and a manufacturing method of a joined body of the circuit board and the base substrate.SOLUTION: The manufacturing method of a circuit board having an insulating layer including a resin and a circuit, in this order, includes a circuit thickness derivation step, in which a thickness of the circuit is derived when a thermal resistance value calculated using thermal conductivity and a thickness value of each layer stacked in a thickness direction of a virtual body including the circuit board becomes a target value and a circuit formation step in which the circuit is formed to have the thickness derived in the circuit thickness derivation step.SELECTED DRAWING: None 【課題】ベース基板との接合時における反りの抑制と、熱伝導性と、を両立した回路基板が得られる回路基板の製造方法及び前記回路基板とベース基板との接合体の製造方法の提供。【解決手段】樹脂を含む絶縁層と、回路と、をこの順に有する回路基板の製造方法であって、前記回路基板を含む仮想体の厚み方向に積層される各層の熱伝導率及び厚みの値を用いて算出される熱抵抗値が目標値となるときの、前記回路の厚みを導き出す回路厚み導出工程と、前記回路厚み導出工程において導き出された厚みとなるように前記回路を形成する回路形成工程と、を備える回路基板の製造方法。【選択図】なし