THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED SHEET, PRINTED WIRING BOARD AND MODULE ADAPTIVE TO HIGH-SPEED COMMUNICATION

To provide a thermosetting resin composition that has low thermal expansion and is not only excellent in dielectric characteristics and solder heat resistance in a high frequency band but also excellent in moisture-absorption solder heat resistance and to provide a prepreg, a laminated sheet, a printed wiring board and a module adaptive to high-speed communication, each using the thermosetting resin composition.SOLUTION: The thermosetting resin composition contains: (A) an addition reaction product of (a1) a maleimide compound having at least two N-substituted maleimide groups and (a2) an amine compound having at least two primary amino groups; (B) an acrylic elastomer; and (C) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.SELECTED DRAWING: None 【課題】低熱膨張性を有し、且つ、高周波帯域における誘電特性及びはんだ耐熱性に優れると共に、吸水はんだ耐熱性にも優れる熱硬化性樹脂組成物を提供すること、並びに、該熱硬化性樹脂組成物を用いた、プリプレグ、積層板、プリント配線板及び高速通信対応モジュールを提供すること。【解決手段】（Ａ）少なくとも２個のＮ−置換マレイミド基を有するマレイミド化合物（ａ１）と、少なくとも２個の１級アミノ基を有するアミン化合物（ａ２）との付加反応物と、（Ｂ）アクリル系エラストマーと、（Ｃ）芳香族ビニル化合物由来の構造単位とカルボン酸無水物由来の構造単位とを含有する共重合樹脂と、を含有してなる熱硬化性樹脂組成物。【選択図】なし