SURFACE-TREATED COPPER FOIL

To provide an improved surface-treated copper foil that is resistant to rusting and discoloration.SOLUTION: More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG HUEI-FANG, CHOU JUIANG, CHENG KUEI-SEN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide an improved surface-treated copper foil that is resistant to rusting and discoloration.SOLUTION: More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to the one or both sides of the copper foil or one or both barrier layer(s), wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %.SELECTED DRAWING: Figure 2 【課題】本発明は、耐錆性および耐変色性を有し、改良された表面処理銅箔に関する。【解決手段】より具体的に、前記表面処理銅箔は、クロムフリーであり、（ａ）銅箔と、必要に応じて（ｂ）前記銅箔の片面または両面に設けられ、Ｎｉ、Ｚｎ、Ｃｏ、Ｍｎ、Ｓｎまたはそれらの混合物を含むバリア層と、（ｃ）前記銅箔の片面または両面あるいは一つまたは二つのバリア層に結合される有機層（ｃ）とを含み、前記有機層におけるＮ、Ｓ、およびＳｉ元素の合計は、５正規化原子％を超える。【選択図】図２