WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
To provide a wiring board that can mount a plurality of electronic components with high relative angle accuracy and reduce weight, and provide highly reliable electronic device and electronic module.SOLUTION: A wiring board (1) includes a substrate (10) having a plurality of surfaces, the plurality...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a wiring board that can mount a plurality of electronic components with high relative angle accuracy and reduce weight, and provide highly reliable electronic device and electronic module.SOLUTION: A wiring board (1) includes a substrate (10) having a plurality of surfaces, the plurality of surfaces include a first surface (S1), a second surface (S2), and a third surface (S3) on which electronic components are mounted and have relative angles intersecting with each other, and the substrate (10) further includes a cavity (12) open in one of the plurality of surfaces. An electronic device includes a wiring board (1) and electronic components mounted on a first surface (S1), a second surface (S2), and a third surface (S3) of the wiring board. The electronic module includes the electronic device and a module board on which the electronic device is mounted.SELECTED DRAWING: Figure 1
【課題】複数の電子部品を高い相対角度精度で実装でき、かつ、重量の低減を図れる配線基板を提供する。さらに、高い信頼性を有する電子装置及び電子モジュールを提供する。【解決手段】この配線基板(1)は、複数の面を有する基体(10)を備え、複数の面は、電子部品が搭載されかつ互いに交差する相対角度を有する第1面(S1)、第2面(S2)及び第3面(S3)を含み、基体(10)は複数の面のうちの1つの面に開口した空洞部(12)を更に有する。電子装置は、配線基板(1)と、配線基板の第1面(S1)、第2面(S2)、第3面(S3)のそれぞれに搭載された電子部品とを備える。電子モジュールは、上記の電子装置と、電子装置が搭載されたモジュール基板とを備える。【選択図】図1 |
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