MALEIMIDE COMPOUND AND METHOD FOR PRODUCING THE SAME, AMIDE ACID COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, CURED PRODUCT, RESIN SHEET, PREPREG, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE

To provide a maleimide compound that expresses excellent adhesiveness to a chip, a substrate or the like, and a method of producing the same.SOLUTION: The present invention relates to a maleimide compound represented by the formula (1) (where, R1 independently represent a hydrogen atom, a C1-6 linea...

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Hauptverfasser: KUMAZAWA YUNE, SUZUKI TAKUYA, YOTSUYA SEIJI, KATAGIRI SHUNSUKE
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a maleimide compound that expresses excellent adhesiveness to a chip, a substrate or the like, and a method of producing the same.SOLUTION: The present invention relates to a maleimide compound represented by the formula (1) (where, R1 independently represent a hydrogen atom, a C1-6 linear or branched alkyl group, a halogen atom, a hydroxy group, or a C1-6 linear or branched alkoxy group, R2 is a hydrogen atom, or a C1-6 linear or branched alkyl group, R3 and R4 independently represent a hydrogen atom, a halogen atom, a C1-6 linear or branched alkyl group, or a C1-6 linear or branched alkenyl group. n is an integer of 1-30 and m independently represent an integer of 1-4).SELECTED DRAWING: None 【課題】チップ及び基板等との優れた接着性を発現する、マレイミド化合物及びその製造方法を提供する。【解決手段】下記式(1)で表されるマレイミド化合物。(式(1)中、R1は、各々独立に、水素原子、炭素数1〜6の直鎖状若しくは分枝状のアルキル基、ハロゲン原子、ヒドロキシ基、又は炭素数1〜6の直鎖状若しくは分枝状のアルコキシ基を示し、R2は、水素原子、又は炭素数1〜6の直鎖状若しくは分枝状のアルキル基を示し、R3及びR4は、各々独立に、水素原子、ハロゲン原子、炭素数1〜6の直鎖状若しくは分岐状のアルキル基、又は炭素数1〜6の直鎖状若しくは分岐状のアルケニル基を示す。nは、1〜30の整数を示し、mは、各々独立に、1〜4の整数を示す。)【選択図】なし