METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL

To provide an electrolytic copper foil which is a thin electrolytic copper foil having an electrical conductivity of not less than 99% and measures not more than 10 μm, in which the problem of warpage is suppressed, the front and back surfaces are smooth, the tensile strength is not less than 500 MP...

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1. Verfasser: OGURO RYOICHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an electrolytic copper foil which is a thin electrolytic copper foil having an electrical conductivity of not less than 99% and measures not more than 10 μm, in which the problem of warpage is suppressed, the front and back surfaces are smooth, the tensile strength is not less than 500 MPa, and the elongation is not less than 5.5%, and provide a method for producing the same.SOLUTION: An electrolytic copper foil is obtained by using an electrolytic solution containing no heavy metals other than copper metal, and has a tensile strength of 500 Mpa or more, an electric conductivity of 99% or more, surface roughness of both front and rear surfaces of 2.5 μm or less, a thickness of 10 μm or less, and an elongation of 5.5% or more.SELECTED DRAWING: None 【課題】電気導電率が99%以上、10μm以下の薄い電解銅箔で、反りの問題が抑制された、表裏が平滑で、引張強度が500Mpa以上で、且つ、伸び率が5.5%以上の電解銅箔及び製造方法の提供。【解決手段】銅金属以外に重金属を含有しない電解液を用いて得られた電解銅箔であり、引張強度が500Mpa以上であり、電気導電率が99%以上であり、表裏の表面粗度が何れも2.5μm以下であり、厚みが10μm以下であり、且つ、伸び率が5.5%以上である電解銅箔。【選択図】 なし