HEAT RADIATING MECHANISM AND POWER SUPPLY DEVICE INCLUDING THE SAME

To provide a heat radiating mechanism that can reliably detect an abnormality of a cooling fan and deterioration in performance of a heat radiating fin.SOLUTION: A heat radiating mechanism 300 includes: a cooling fan 500; first and second heat radiating plates 410 and 420 provided with first and second heat radiating fins 411 and 421, respectively; and a plurality of power semiconductor modules 450 mounted on the first heat radiating plate 410. The second heat radiating plate 420 is arranged on the leeward side of at least one power semiconductor module 450, and a thermistor 440 is attached to the second heat radiating plate. The second heat radiating plate 420 is heat-insulated from the first heat radiating plate 410. The second heat radiating plate 420 is attached to the first heat radiating plate 410 such that the position of the second heat radiating fin 421 coincides with the position of the first heat radiating fin 411.SELECTED DRAWING: Figure 2 【課題】冷却ファンの異常や放熱フィンの性能低下を確実に検知できる放熱機構を提供する。【解決手段】放熱機構３００は、冷却ファン５００と、第１及び第２の放熱フィン４１１，４２１がそれぞれ設けられた第１及び第２の放熱板４１０，４２０と、第１の放熱板４１０に取り付けられた複数のパワー半導体モジュール４５０と、を備えている。第２の放熱板４２０は少なくとも１つのパワー半導体モジュール４５０の風下側に配置されるとともに、サーミスタ４４０が取り付けられている。第２の放熱板４２０は第１の放熱板４１０と断熱されている。第２の放熱板４２０は、第２の放熱フィン４２１の位置が第１の放熱フィン４１１の位置と一致するように、第１の放熱板４１０に取り付けられている。【選択図】図２