RADIATION IMAGING DEVICE AND RADIATION IMAGING SYSTEM

To provide technology which is advantageous for separating between respective members without lowering the rigidity of a sensor base in a radiation imaging device that includes a sensor panel in which a sensor board is disposed on the sensor base and a scintillator panel.SOLUTION: Provided is a radi...

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Hauptverfasser: HOSHINA TOMOHIRO, NISHIBE KOTA
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide technology which is advantageous for separating between respective members without lowering the rigidity of a sensor base in a radiation imaging device that includes a sensor panel in which a sensor board is disposed on the sensor base and a scintillator panel.SOLUTION: Provided is a radiation imaging device including a scintillator panel, a sensor base, and a sensor board disposed between the scintillator panel and the sensor base, the sensor base including a first base and a second base disposed between the first base and the sensor board and the rigidity of which is lower than the first base. The scintillator panel and the sensor board are joined together by a first coupling layer, the sensor board and the second base are joined together by a second coupling layer, and the first base and the second base are joined together by a third coupling layer, the first and second bases joined together by the third coupling layer being separable while maintaining the respective joining by the first and second coupling layers.SELECTED DRAWING: Figure 1 【課題】センサ基板をセンサ基台上に配したセンサパネルとシンチレータパネルとを含む放射線撮像装置において、センサ基台の剛性を低下させることなく、それぞれの部材間を分離するのに有利な技術を提供する。【解決手段】シンチレータパネルと、センサ基台と、シンチレータパネルとセンサ基台との間に配されるセンサ基板と、を含む放射線撮像装置であって、センサ基台は、第1基台と、第1基台とセンサ基板との間に配され、第1基台よりも剛性が低い第2基台と、を含み、シンチレータパネルとセンサ基板とは、第1結合層によって結合され、センサ基板と第2基台とは、第2結合層によって結合され、第1基台と第2基台とは、第3結合層によって結合され、第1結合層および第2結合層によるそれぞれの結合を維持しつつ、第3結合層によって結合された第1基台と第2基台とを分離可能である。【選択図】図1