PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a...
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| creator | KOMATSU MASATORA SATO WAKIKO TAJIMA MORIKAZU MORITA TAKAAKI |
| description | To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a printed wiring board using a liquid crystal polymer having wiring formed on at least one surface as a base material, the base material has a crystal orientation of the liquid crystal polymer in the plane direction of 0.3 or less.SELECTED DRAWING: None
【課題】液晶ポリマーを用いた基材の局所的な特性（機械的特性、電気特性）の偏りを低減したプリント配線板、多層プリント配線板およびプリント配線板の製造方法を提供する。【解決手段】少なくとも片面に配線を形成した液晶ポリマーを基材とするプリント配線板であって、基材は、面方向における液晶ポリマーの結晶配向度が０．３以下である。【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021012975A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021012975A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021012975A3</originalsourceid><addsrcrecordid>eNrjZEgPCPL0C3F1UQj3BDLcFZz8HYNcdBR8Q31CPH0cI12DFLArcPRzUfB19At1c3QOCQVL-LqGePi7KPi7YdXBw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDIwMDQyNLM1NHY2JUgQAS001ow</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD</title><source>esp@cenet</source><creator>KOMATSU MASATORA ; SATO WAKIKO ; TAJIMA MORIKAZU ; MORITA TAKAAKI</creator><creatorcontrib>KOMATSU MASATORA ; SATO WAKIKO ; TAJIMA MORIKAZU ; MORITA TAKAAKI</creatorcontrib><description>To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a printed wiring board using a liquid crystal polymer having wiring formed on at least one surface as a base material, the base material has a crystal orientation of the liquid crystal polymer in the plane direction of 0.3 or less.SELECTED DRAWING: None
【課題】液晶ポリマーを用いた基材の局所的な特性（機械的特性、電気特性）の偏りを低減したプリント配線板、多層プリント配線板およびプリント配線板の製造方法を提供する。【解決手段】少なくとも片面に配線を形成した液晶ポリマーを基材とするプリント配線板であって、基材は、面方向における液晶ポリマーの結晶配向度が０．３以下である。【選択図】なし</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210204&DB=EPODOC&CC=JP&NR=2021012975A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210204&DB=EPODOC&CC=JP&NR=2021012975A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOMATSU MASATORA</creatorcontrib><creatorcontrib>SATO WAKIKO</creatorcontrib><creatorcontrib>TAJIMA MORIKAZU</creatorcontrib><creatorcontrib>MORITA TAKAAKI</creatorcontrib><title>PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD</title><description>To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a printed wiring board using a liquid crystal polymer having wiring formed on at least one surface as a base material, the base material has a crystal orientation of the liquid crystal polymer in the plane direction of 0.3 or less.SELECTED DRAWING: None
【課題】液晶ポリマーを用いた基材の局所的な特性（機械的特性、電気特性）の偏りを低減したプリント配線板、多層プリント配線板およびプリント配線板の製造方法を提供する。【解決手段】少なくとも片面に配線を形成した液晶ポリマーを基材とするプリント配線板であって、基材は、面方向における液晶ポリマーの結晶配向度が０．３以下である。【選択図】なし</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgPCPL0C3F1UQj3BDLcFZz8HYNcdBR8Q31CPH0cI12DFLArcPRzUfB19At1c3QOCQVL-LqGePi7KPi7YdXBw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDIwMDQyNLM1NHY2JUgQAS001ow</recordid><startdate>20210204</startdate><enddate>20210204</enddate><creator>KOMATSU MASATORA</creator><creator>SATO WAKIKO</creator><creator>TAJIMA MORIKAZU</creator><creator>MORITA TAKAAKI</creator><scope>EVB</scope></search><sort><creationdate>20210204</creationdate><title>PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD</title><author>KOMATSU MASATORA ; SATO WAKIKO ; TAJIMA MORIKAZU ; MORITA TAKAAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021012975A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KOMATSU MASATORA</creatorcontrib><creatorcontrib>SATO WAKIKO</creatorcontrib><creatorcontrib>TAJIMA MORIKAZU</creatorcontrib><creatorcontrib>MORITA TAKAAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOMATSU MASATORA</au><au>SATO WAKIKO</au><au>TAJIMA MORIKAZU</au><au>MORITA TAKAAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD</title><date>2021-02-04</date><risdate>2021</risdate><abstract>To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a printed wiring board using a liquid crystal polymer having wiring formed on at least one surface as a base material, the base material has a crystal orientation of the liquid crystal polymer in the plane direction of 0.3 or less.SELECTED DRAWING: None
【課題】液晶ポリマーを用いた基材の局所的な特性（機械的特性、電気特性）の偏りを低減したプリント配線板、多層プリント配線板およびプリント配線板の製造方法を提供する。【解決手段】少なくとも片面に配線を形成した液晶ポリマーを基材とするプリント配線板であって、基材は、面方向における液晶ポリマーの結晶配向度が０．３以下である。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD |
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