PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU MASATORA, SATO WAKIKO, TAJIMA MORIKAZU, MORITA TAKAAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a printed wiring board, a multilayer printed wiring board, and a manufacturing method of the printed wiring board in which the bias of local characteristics (mechanical characteristics, electrical characteristics) of a base material using a liquid crystal polymer is reduced.SOLUTION: In a printed wiring board using a liquid crystal polymer having wiring formed on at least one surface as a base material, the base material has a crystal orientation of the liquid crystal polymer in the plane direction of 0.3 or less.SELECTED DRAWING: None 【課題】液晶ポリマーを用いた基材の局所的な特性（機械的特性、電気特性）の偏りを低減したプリント配線板、多層プリント配線板およびプリント配線板の製造方法を提供する。【解決手段】少なくとも片面に配線を形成した液晶ポリマーを基材とするプリント配線板であって、基材は、面方向における液晶ポリマーの結晶配向度が０．３以下である。【選択図】なし