DOUBLE-SIDED POLISHING DEVICE CONTROLLING SYSTEM, CONTROL DEVICE AND SUBSTRATE MANUFACTURING METHOD

To provide a double-sided polishing device controlling system which can quickly control a substrate flatness with high accuracy by controlling polishing conditions, a control device and a substrate manufacturing method.SOLUTION: A controlling system for a double-sided polishing device 10 polishes a TOP surface 30a and a BOT surface 30b of an object W to be polished in such a manner that the object W to be polished is sandwiched between an upper surface plate 21 and a lower surface plate 32, and the upper surface plate and the lower surface plate are rotated. In this system, a TOP surface workload PT (Ws) required for polishing the TOP surface 30a and a BOT surface workload PB (Ws) required for polishing the BOT surface 30b are respectively calculated, and polishing conditions are controlled so that a difference between the calculated TOP surface workload PT and BOT surface workload PB falls within a prescribed range.SELECTED DRAWING: Figure 4 【課題】研磨条件を制御することにより基板の平坦度を高い精度で速やかに制御することができる両面研磨装置の制御システム、制御装置および基板の製造方法を提供する。【解決手段】被研磨体Ｗを上定盤２１と下定盤３２との間に挟んで上定盤と下定盤を回転させることにより被研磨体ＷのＴＯＰ面３０ａおよびＢＯＴ面３０ｂを研磨する両面研磨装置１０の制御システムにおいて、ＴＯＰ面３０ａの研磨に要するＴＯＰ面仕事量ＰＴ（Ｗｓ）と、ＢＯＴ面３０ｂの研磨に要するＢＯＴ面仕事量ＰＢ（Ｗｓ）とをそれぞれ算出し、算出されたＴＯＰ面仕事量ＰＴとＢＯＴ面仕事量ＰＢとの差を所定の範囲内に収めるように研磨条件を制御することを特徴とする。【選択図】図４