WAFER PROCESSING METHOD

To decrease, when processing stuck wafers with a cavity in a sticking surface thereof to expose the cavity, roughness formed around the cavity.SOLUTION: A wafer processing method in which stuck wafers W having a cavity W1d in a sticking surface W1a in which two wafers W1, W2 are stuck together are ground to expose the cavity W1d, comprises: a holding step in which the stuck wafers W are held on a chuck table 3; a grinding step in which the stuck wafers W held on the chuck table 3 are ground by a grind stone and grinding is stopped immediately before the cavity W1d is exposed; and a polishing step in which, after the grinding step, a ground surface W1b of the stuck wafers W is polished with slurry and a polishing pad 76 to expose the cavity W1d.SELECTED DRAWING: Figure 3 【課題】貼り合わせ面に空洞を有する貼り合わせウェーハを加工して空洞を露出させる場合に、空洞の周囲に形成される凸凹を小さくする。【解決手段】２枚のウェーハＷ１、Ｗ２を貼り合わせた貼り合わせ面Ｗ１ａに空洞Ｗ１ｄを有する貼り合わせウェーハＷを研削して空洞Ｗ１ｄを露出させるウェーハの加工方法であって、貼り合わせウェーハＷをチャックテーブル３に保持させる保持工程と、チャックテーブル３に保持された貼り合わせウェーハＷを研削砥石で研削し空洞Ｗ１ｄが露出する直前で研削を停止させる研削工程と、研削工程後に、貼り合わせウェーハＷの被研削面Ｗ１ｂをスラリーと研磨パッド７６とで研磨し空洞Ｗ１ｄを露出させる研磨工程と、を備えるウェーハの加工方法。【選択図】図３