SEMICONDUCTOR DEVICE
To suppress the occurrence of peeling between a semiconductor substrate and a surface structure.SOLUTION: A semiconductor device includes a semiconductor element and a sealant that seals the semiconductor element. The semiconductor element includes a semiconductor substrate, a metal film provided on...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | To suppress the occurrence of peeling between a semiconductor substrate and a surface structure.SOLUTION: A semiconductor device includes a semiconductor element and a sealant that seals the semiconductor element. The semiconductor element includes a semiconductor substrate, a metal film provided on the semiconductor substrate, and a protective film provided on the semiconductor substrate and covering the metal film. On the surface of the semiconductor substrate, one or a plurality of recesses are provided in a portion facing the outer peripheral portion located outside the metal film of the protective film. The protective film extends into the one or more recesses.SELECTED DRAWING: Figure 3
【課題】半導体基板と表面構造との間で剥離が生じることを抑制する。【解決手段】半導体装置は、半導体素子と、半導体素子を封止する封止体とを備える。半導体素子は、半導体基板と、半導体基板上に設けられた金属膜と、半導体基板上に設けられており、金属膜を覆う保護膜とを備える。半導体基板の表面には、保護膜の金属膜よりも外側に位置する外周部分と対向する部分において、一つ又は複数の凹部が設けられている。保護膜は、一つ又は複数の凹部の内部にまで延びている。【選択図】図３ |
|---|