HEATING DEVICE

To provide a heating device enabling suppression of malfunction.SOLUTION: A heating device includes: a heater 20; a power source board 80 supplying a power source to the heater 20; a thermostat 85 disposed on the upper side in the vertical direction of the power source board 80; a lead wire 87 conne...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SATO HIROETSU, KASAWA YUJI, SHIROHARA YUKI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a heating device enabling suppression of malfunction.SOLUTION: A heating device includes: a heater 20; a power source board 80 supplying a power source to the heater 20; a thermostat 85 disposed on the upper side in the vertical direction of the power source board 80; a lead wire 87 connecting the power source board 80 with the thermostat 85; a main control board 70 disposed between the power source board 80 and the thermostat 85 and controlling the supply of the power source from the power source board 80 to the heater 20; a casing 30 having a heater chamber 30a accommodating the heater 20 and a board chamber 30b accommodating the power source board 80, the thermostat 85, the lead wire 87 and the main control board 70; and a partition plate 60 partitioning the board chamber 30b into a first space 90 having the power source board 80 and the lead wire 87 and a second space 91 having the main control board 70.SELECTED DRAWING: Figure 3 【課題】誤動作を抑制できる暖房機を提供する。【解決手段】ヒータ20と、ヒータ20へ電源を供給する電源基板80と、電源基板80の鉛直方向上方に配置されるサーモスタット85と、電源基板80とサーモスタット85を接続するリード線87と、電源基板80とサーモスタット85の間に配置され、電源基板80からヒータ20への電源の供給を制御する主制御基板70と、ヒータ20を収容するヒータ室30aと、電源基板80、サーモスタット85、リード線87および主制御基板70を収容する基板室30bと、を有する筐体30と、基板室30bを、電源基板80およびリード線87を含む第一空間90と、主制御基板70を含む第二空間91と、に仕切る仕切板60と、を備える。【選択図】図3