WASHING METHOD FOR OPTICAL SURFACE MONITORING DEVICE
To provide a washing method capable of removing abrasive grains adhered to an optical passage in a polishing table.SOLUTION: A washing method slides a substrate W on an abrasive pad 2 while supplying a slurry containing abrasive grains on the abrasive pad 2 supported by a polishing table 3 and polis...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a washing method capable of removing abrasive grains adhered to an optical passage in a polishing table.SOLUTION: A washing method slides a substrate W on an abrasive pad 2 while supplying a slurry containing abrasive grains on the abrasive pad 2 supported by a polishing table 3 and polishes the substrate W, leads light to the substrate W through an optical path 50A provided in the polishing table 3 while polishing the substrate W, passes reflecting light from the substrate W through the optical path 50A, removes the polished substrate W from the abrasive pad 2, supplies chemical liquid in the optical path 50A in the state that there is no substrate on the abrasive pad 2, and removes the abrasive grains adhered to the optical path 50A.SELECTED DRAWING: Figure 2
【課題】研磨テーブル内の光通路に付着した砥粒を除去することができる洗浄方法を提供する。【解決手段】本洗浄方法は、研磨テーブル3に支持された研磨パッド2上に、砥粒を含むスラリーを供給しながら、基板Wを研磨パッド2に摺接させて、該基板Wを研磨し、基板Wの研磨中に、研磨テーブル3内に設けられた光通路50Aを通じて基板Wに光を導き、かつ基板Wからの反射光を光通路50A内を通過させ、研磨された基板Wを研磨パッド2から除去し、研磨パッド2上に基板が存在しない状態で、光通路50A内に薬液を供給して、光通路50Aに付着した砥粒を薬液によって除去する。【選択図】図2 |
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