ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATION MATERIAL, SOLDER RESIST RESIN MATERIAL, AND RESIST COMPONENT

To provide an acid group-containing (meth)acrylate resin excellent in alkali developability and high photo sensitivity, of which cured product has excellent elasticity and adhesion to a substrate, a curable resin composition containing the same, a cured product of the curable resin composition, an i...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA SHUNSUKE, KAMEYAMA YASUSHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an acid group-containing (meth)acrylate resin excellent in alkali developability and high photo sensitivity, of which cured product has excellent elasticity and adhesion to a substrate, a curable resin composition containing the same, a cured product of the curable resin composition, an insulation material, a solder resist resin material, and a resist component.SOLUTION: An acid group-containing (meth)acrylate resin for use is made from essential reaction raw materials comprising an epoxy resin (A), an unsaturated monobasic acid (B), an aromatic compound (C) having at least two hydroxy groups on the aromatic ring and at least one functional group in a molecule, reactive with an epoxy group of the epoxy resin (A), and a polybasic acid anhydride (D).SELECTED DRAWING: None 【課題】優れたアルカリ現像性及び高い光感度を有し、硬化物における優れた伸度及び基材密着性を有する酸基含有(メタ)アクリレート樹脂、これを含有する硬化性樹脂組成物、前記硬化性樹脂組成物からなる硬化物、絶縁材料、ソルダーレジスト用樹脂材料、及びレジスト部材を提供する。【解決手段】エポキシ樹脂(A)と、不飽和一塩基酸(B)と、芳香環上に少なくとも2つの水酸基、及び一分子中に少なくとも1つの前記エポキシ樹脂(A)が有するエポキシ基と反応し得る官能基を有する芳香族化合物(C)と、多塩基酸無水物(D)とを必須の反応原料とすることを特徴とする酸基含有(メタ)アクリレート樹脂を用いる。【選択図】なし