SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER METHOD
To provide a substrate processing apparatus, substrate processing system and substrate transfer method, capable of suppressing generation of a failure in an electrostatic chuck.SOLUTION: The substrate processing apparatus includes: a loading base having a first loading part for placing a substrate a...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a substrate processing apparatus, substrate processing system and substrate transfer method, capable of suppressing generation of a failure in an electrostatic chuck.SOLUTION: The substrate processing apparatus includes: a loading base having a first loading part for placing a substrate and a second loading part for placing an edge ring on the outer periphery of the substrate; a support pin liftably arranging the loading base at a through hole for penetrating it through at the second loading part; a lifting device for lifting the support pin; and a control section for controlling the lifting device.SELECTED DRAWING: Figure 1
【課題】静電チャックにおける不具合の発生を抑制する基板処理装置、基板処理システム及び基板搬送方法を提供する。【解決手段】基板を載置する第1載置部及び前記基板の外周にエッジリングを載置する第2載置部とを有する載置台と、前記第2載置部において前記載置台を貫通する貫通孔に昇降自在に配置される支持ピンと、前記支持ピンを昇降させる昇降装置と、前記昇降装置を制御する制御部と、備える、基板処理装置。【選択図】図1 |
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